Brief: Discover the WDS800A Laser BGA Reballing Machine, a state-of-the-art solution for automatic chip feeding, soldering, and desoldering. Featuring advanced hot air and IR heating systems, precise motor control, and high-resolution optical vision, this machine ensures efficient and accurate BGA rework. Perfect for lead-free soldering and large PCB repairs.
Related Product Features:
Automatic chip feeding, pickup, and blowing for seamless operation.
Integrated hot air head and mounting head with auto soldering and desoldering functions.
Upper heaters with hot air system for faster, even heating and cooling (50-80°C).
Lower heaters with Hot air & IR mix heating for quick, even temperature distribution.
High-precision slider for accurate BGA and PCB alignment.
Preheating table with Germany-imported materials, heat-resistant up to 1800°C.
Color high-resolution optical vision system with 22x optical zoom for precise rework.
Inbuilt vacuum pump and 360° adjustable suction nozzle for versatile chip handling.
Les questions:
What is the maximum PCB size the WDS800A can handle?
The WDS800A can handle PCB sizes up to 630*480mm with no repair dead corners, ensuring efficient repairs for large boards.
Does the WDS800A support lead-free soldering?
Yes, the WDS800A is designed to meet technological requirements for lead-free soldering with its advanced heating systems and precise temperature control.
How does the WDS800A ensure accurate alignment during rework?
The WDS800A features a high-resolution optical vision system with 22x zoom, split vision, and auto-focus, along with motor-controlled X/Y axis movement for precise alignment.